Electroless Deposition and Electroplating of Metals
نویسندگان
چکیده
منابع مشابه
Microfluidic Patterning of Metal Structures for Flexible Conductors by In Situ Polymer‐Assisted Electroless Deposition
A low-cost, solution-processed, versatile, microfluidic approach is developed for patterning structures of highly conductive metals (e.g., copper, silver, and nickel) on chemically modified flexible polyethylene terephthalate thin films by in situ polymer-assisted electroless metal deposition. This method has significantly lowered the consumption of catalyst as well as the metal plating solution.
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